The product features high density, lightweight and miniaturization. It enables reliable interconnection of electrical circuits within the system, from one cable to another, from cable to printed circuit board, and from printed circuit board to printed circuit board. The product can withstand harsh usage environments such as strong vibration and impact, and is particularly suitable for applications with specific requirements for space utilization and lightweight of equipment.

The product features high density, lightweight, and miniaturization. It enables reliable interconnection of electrical circuits within the system, from one cable to another, from cable to printed circuit board, and from printed circuit board to printed circuit board. The product can withstand harsh usage environments such as strong vibration and impact, and is particularly suitable for applications with specific requirements for space utilization and lightweight of equipment.